ligitek electronics co.,ltd. property of ligitek only data sheet LUY9653-30B doc. no : qw0905-LUY9653-30B rev. : a date : 16 - dec. - 2005 square with 4leads type led lamps pb lead-free parts
anode cathode c1.25 r0.7 ligitek electronics co.,ltd. property of ligitek only page 1/5 package dimensions part no. LUY9653-30B 30 60 75%100% 25%50% -30 directivity radiation 0 25% 75%50% 100% -60 0 note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 4.4 0.5 3.5 0.5 2.5 0.5 5.08 0.3 0.4 1.55 5.08 0.5 7.62 0.5 3.0 7.62 0.5 1.9
note : 1.the forward voltage data did not including ! 0.1v testing tolerance. 2. the luminous intensity data did not including ! 15% testing tolerance. dominant wave length # dnm typical electrical & optical characteristics (ta=25 $ ) algainp material LUY9653-30B part no yellow water clear color emittedlens luminous intensity @20ma(mcd) viewing angle 2 % 1/2 (deg) forward voltage @20ma(v) spectral halfwidth &# nm 2.6 15 1.7 595 min.max. 70 220400 typ. min. esd electrostatic discharge( * ) operating temperature storage temperature t opr tstg forward current peak forward current duty 1/10@10khz reverse current @5v power dissipation ir pd i fp i f v 2000 -40 ~ +85 -40 ~ +100 $ $ 10 120 90 50 ' a mw ma ma absolute maximum ratings at ta=25 $ parameter symbol page 2/5 ratings uy unit ligitek electronics co.,ltd. property of ligitek only part no. LUY9653-30B static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. *
ambient temperature( ) fig.4 relative intensity vs. temperature r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 500 0 0.5 550600650 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z @ 2 5 -20 1.0 -40 0.8 20 060 40 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 100 80-40-20 0 020 3.0 2.5 2.0 1.5 1.0 80 60 40100 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current forward current(ma) 4.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 10 1.0 forward voltage(v) 2.03.0 1000 uy chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 2.0 1.5 1.0 0.5 5.0 0 1.010 3.0 2.5 page3/5 1001000 part no. LUY9653-30B
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 4/5 0 preheat 0 2 /sec max 100 50 150 time(sec) temp( c) 120 5 /sec max 260 c3sec max 60 seconds max part no. LUY9653-30B
reference standard description page 5/5 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 test condition test item reliability test: 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) operating life test low temperature storage test high temperature storage test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles high temperature high humidity test thermal shock test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hous. this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. ligitek electronics co.,ltd. property of ligitek only mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to see soldering well performed or not. solder resistance test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=260 5 2.dwell time= 10 1sec. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 part no. LUY9653-30B
stopple stopple tubeled packing specification 1. 60pcs / tube 2. 105tubes / inner box size : l x w x h 55cm x 22.5cm x 10cm 3. 4 inner boxes / carton size : l x w x h 56.5cm x 47.5cm x 24cm i t e m n o . q ' t y : p c s n , w , : k g s g , w , : k g s c/no: made in china w h l l w h
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